Implementation, Assembly, and Parts Processing Technology: Implementation and Assembly Manufacturing Technology
General-purpose equipment and tools developed by our company contribute to improving quality and productivity!
We would like to introduce our "Implementation and Assembly Manufacturing Technology." In terms of mounting substrates, we have experience with flexible substrates, glass-epoxy substrates, ceramic substrates, and others, ranging from small to large sizes. For mounted components, we can accommodate everything from microchips to large connectors and bottom electrode components. We carry out assembly work using our internally manufactured substrates and components supplied by customers, producing with consideration for product characteristics, production time, and quantity through cell production, partial cells, and line production. 【Supported Substrate Sizes (M and L Sizes)】 ■ Supported substrate sizes: 50mm x 50mm (MIN) to 510mm x 380mm (MAX) ■ Substrate thickness: 0.4mm and above (FPC is supported with pallet transport) *For more details, please refer to the related links or feel free to contact us.
- Company：新生電子
- Price：Other
